Peng Li | Booky.fi

Intelligent Vehicles - Second CCF Intelligent Vehicles Symposium, CIVS 2024, Wuhan, China, October 19–20, 2024, Revised Selected

Li, Huiyun; Sun, Peng; Tian, Daxin; Sheng, Zhengguo; Leung, Victor; Xia, Huaxia; Hong, Yong
Springer Verlag, Singapore
2025
Pehmeäkantinen kirja

137,60 €

Theory and Applications of Models of Computation - 19th Annual Conference, TAMC 2025, Jinan, China, September 19–21, 2025, Proce

Li, Min; Xia, Mingji; Zhang, Peng
Springer Verlag, Singapore
2026
Pehmeäkantinen kirja

93,80 €

INTRODUCTION TO MODERN QUANTUM OPTICS

Peng, Jin-Sheng; Li, Gao-Xiang
World Scientific Publishing Co Pte Ltd
1998
Kovakantinen kirja

132,40 €

Materials Engineering—From Ideas to Practice: An EPD Symposium in Honor of Jiann-Yang Hwang

Li, Bowen; Zhao, Baojun; Li, Jian; Monteiro, Sergio Neves; Peng, Zhiwei; Gregurek, Dean; Jiang, Tao; Shi, Yong; Huang, Cuiping;
Springer
2022
Pehmeäkantinen kirja

178,30 €

Cloud Native Database - Principle and Practice

Li, Feifei; Zhou, Xuan; Cai, Peng; Zhang, Rong; Huang, Gui; Liu, XiangWen
Springer Verlag, Singapore
2025
Kovakantinen kirja

51,10 €

Proceedings of the 12th International Conference on Cold Climate HVAC & Energy (Volume 2) - CCHVAC 2025

Ni, Long; Wang, Peng; Li, Jiqin; Liu, Yongxin
Springer Verlag, Singapore
2026
Kovakantinen kirja

222,50 €

Intelligent Vehicles - Third CCF Intelligent Vehicles Symposium, CIVS 2025, Hangzhou, China, August 16–18, 2025, Revised Selecte

Li, Huiyun; Wang, Zhongli; Zhao, Shuai; Sun, Peng; Herrmann, Michael; Zheng, Xi; Liu, Yuling
Springer Verlag, Singapore
2026
Pehmeäkantinen kirja

123,10 €

The Proceedings of 2024 International Conference of Electrical, Electronic and Networked Energy Systems : Volume VI

Sha, Aimin (ed.); Zhang, Li (ed.); Peng, Jishen (ed.); Yan, XIaoheng (ed.); Rong, Cancan (ed.); Jin, Zheming (ed.)
Springer
2026
Pehmeäkantinen kirja

266,80 €

Control and Filtering for Semi-Markovian Jump Systems

Li, Fanbiao; Shi, Peng; Wu, Ligang
Springer
2016
Kovakantinen kirja

100,90 €

ENCYCLOPEDIA OF PACKAGING MATERIALS, PROCESSES, AND MECHANICS - SET 1: DIE-ATTACH AND WAFER BONDING TECHNOLOGY (A 4-VOLUME SET)

Zhu, Pengli; Li, Gang; Wong, C P; Jung, Dae Young; Cain, Stephen R; Chen, William (Bill) T; Sammakia, Bahgat G; Bakir, Muhannad
World Scientific Publishing Co Pte Ltd
2019
Kovakantinen kirja