Spot, stop, and analyze IC device failure with this unique illustrated guide. Worth more than a thousand words, each illustration in "Failure- Free Integrated Circuit Packages" gives you a visual reference on common failure modes of IC devices in organic packages. In addition, the wide knowledge base of the chapter authors provides you with proven, leading-edge failure analysis techniques. "Failure-Free Integrated Circuit Packages" helps you: find, identify, and correct potential failures before they occur; improve device reliability; learn from case studies of IC package failure modes; quickly locate failures through visual comparisons; apply state-of-the-art failure analysis techniques; comprehend the physics behind the failure mechanism; and, understand the limitations of reliability testing and lifetime estimation.Inside, you'll find a practical and easy way to approach failure analysis of IC's in organic packages.
Areas covered include: fundamentals of IC package technologies; reliability; physics and chemistry of failures in packaged devices; strategies for locating failures; failure analysis techniques; failure modes common in organic IC packages; and, emerging assembly materials for IC packaging.